march 2002 / a page 1 semiconductor tak cheong ? 350 mw do-35 hermetically sealed glass afc / trigger diodes absolute maximum ratings t a = 25c unless otherwise noted symbol parameter value units p d power dissipation 350 mw t stg storage temperature range -65 to +200 c t j operating junction temperature +175 c these ratings are limiting values above which the serviceability of the diode may be impaired. specification features: ? do-35 package (jedec) ? through-hole device type mounting ? hermetically sealed glass ? compression bonded construction ? all external surfaces are corrosion resistant and leads are readily solderable ? cathode indicated by polarity band afc-fv-1043 electrical characteristics t a = 25c unless otherwise noted limits unit parameter test condition min typical max b v i r = 5a 5 volts normal capacitance v r = 5v 5 pf c 0.1 c 4.0 v r = 0.1v v r = 4.0v 1.8 q f = 100m hz 50 afc / trigger diodes l 10 43 device marking diagram l = logo device code = fv1043 axial lead do35 ldb-3 device marking diagram l = logo device code = db3
march 2002 / a page 2 semiconductor tak cheong ? trigger - db3 electrical characteristics t a = 25c unless otherwise noted db3 unit parameter min typical max v bo 28 32 36 volts [v bo? -v bo ] 3 volts [ ? v] 5 volts v o 5 volts i bo 100 a t r 1.5 s i b 10 a electrical symbol definition typical characteristics symbol parameter b v breakdown voltage @ i r v bo breakover voltage @ i bo [v bo? -v bo ] v bo symmetry [ ? v] dynamic breakover voltage v o output voltage i bo breakover current t r rise time i b leakage current i f forward current ordering information device package quantity fv-1043 / db3 bulk 10,000 fv-1043 / db3.tb tape and ammo 5,000 fv-1043 / db3.tr tape and reel 10,000 fv-1043 / db3 others (?contact sales representatives) axial-lead tape packaging standards this axial-lead component?s packaging requirements use in autom atic testing and assembly equipment. and this standard practices for lead-tape packaging of axial-lead components meets the requirements of eia standard rs-296-d ?lead-taping of components on axia l lead configuration for automatic insertion?. +v +i f -i f -v 10ma i bo i b v bo ? v 0.5v
march 2002 / a page 3 semiconductor tak cheong ? tape & reel packaging information tape & reel outline reel dimensions dim millimeters d1 356 d2 30 d3 84 w1 77.5 quantity per reel pkg type quantity per reel do-35 10,000
march 2002 / a page 4 semiconductor tak cheong ? tape & ammo packaging information tape & ammo outline quantity per ammo box pkg type quantity per box do-35 5,000 taping dimensions description millimeters standard width 52 26 tape spacing (b) 52 0.69 26 +0.5 / -0 component pitch (c) 5.08 0.4 5.08 0.4 untaped lead (l1 ? l2) 0.69 0.69 glass offset (f) 0.69 0.69 bent (d) 1.2 max 1.2 max tape width (g) 6.138 0.576 6.138 0.576 tape mismatch (e) 0.55 max 0.55 max taped lead (g) 3.2 min 3.2 min lead beyond tape (h) 0 0 250mm x 80mm x 80mm
march 2002 / a page 5 semiconductor tak cheong ? bulk packaging information bulk outline quantity per box pkg type quantity per box do-35 10,000 plastic bag 250mm x 80mm x 80mm do-35 1000 x 10 plastic bag quantity per plastic bag
march 2002 / a page 6 semiconductor tak cheong ? package outline package case outline do-35 do-35 millimeters inches dim min max min max a 0.46 0.55 0.018 0.022 b 3.05 5.08 0.120 0.200 c 25.40 38.10 1.000 1.500 d 1.53 2.28 0.060 0.090 notes: 1. all dimensions are within jedec standard. 2. do35 polarity denoted by cathode band.
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